edited by L C Zhang (University of Sydney) & N Yasunaga (Tokai University)

This volume aims to promote the latest advances in abrasive technology. Emphasis is placed on both the development of practical methods and the understanding of the mechanisms of machining ceramics, semiconductors, steel alloys, and other advanced materials. About 50 technical papers are included in the volume, describing the recent advances in the mechanics of abrasive machining, mechanisms of grinding, difficult-to-machine materials, grinding wheel technology, machinery and measurement, polishing, lapping, and nano-machining. Theoretically, the book discusses the material removal and deformation mechanisms; from the practical point of view, it provides useful data for direct industrial applications.

• Modelling the Related Processes of Abrasion, Wear and Polishing (P L B Oxley)
• Recent Advances in Ultraprecision Surface Finishing Technologies in Japan (N Yasunaga)
• Possible Mechanism of Brittle-Ductile Transition in Material Removal in Micromachining of Brittle Materials (S Shimada et al.)
• Phase Transformation of Silicon During Nano-Indentation (H Tanaka & L C Zhang)
• Electrophoresis-Polishing with a Partial Electrode Tool (K Suzuki et al.)
• Precision Optical Polishing Using Pitch and Teflon Laps at CSIRO TIP: A Review (A J Leistner)
• High Efficiency Grinding of Difficult-to-Machine Materials (T Suto et al.)
• Practical Modelling of the Surface Integrity of Ground Components (L C Zhang)
• On-Machine Electrodischarge Truing/Dressing Method for Metal Bonded Wheels (T Uematsu et al.)
• Effect of Abrasive Grain Size on Surface Finish and Abrasion in Abrasive-Flow Finishing of Aluminium (K Yamaguchi & N Takakura)
• and other papers